You Searched For: FUJIFILM ELECTRONIC MATERIALS U.S.A


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Description: Hydrochloric Acid, 37% Polybottle, Formula: HCl, CAS Number: 7647-01-0,used in SC-2 solutions to remove surface metallic contamination from silicon wafers. 40lb
Catalog Number: 71009-358
Supplier: KMG

Description: Hydrochloric Acid 37% Cleanroom LP, Standard, Container: Poly bottle, Formula: HCl, CAS Number: 7647-01-0, key ingredient to remove surface metallic ions by forming soluble metal chlorides. 10lb
Catalog Number: 71009-324
Supplier: KMG

Description: Acetone Cleanroom LP, Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover. 350lb.
Catalog Number: 71009-508
Supplier: KMG

Description: Hydrogen Peroxide, 30%, Cleanroom LP, Cas: 7722-84-1, Formula: H2O2, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination.
Catalog Number: 71009-366
Supplier: KMG

Description: Hydrogen Peroxide 30% Cleanroom MB, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-334
Supplier: KMG

Description: Acetone Cleanroom LP, can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover, Formula: CH3COCH3, CAS Number: 67-64-1, Polybottle, 4l
Catalog Number: KM402-200406
Supplier: KMG

Description: CR-16, is a Nitric Acid based chrome etchant used for photolithography masks, semiconductor and MEMS processes. It is designed to provide minimum undercutting, maximum critical dimension control and repeatability
Catalog Number: 10803-036
Supplier: KMG

Description: Hydrogen Peroxide 30% Gigabit*, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-336
Supplier: KMG

Description: Hydrofluoric acid, 49%, Cleanroom Mb, Poly bottle, HF, CAS Number: 7664-39-3, critical chemistry in semiconductor processing. It is used to solubilize many oxides, particularly silicon dioxide, the most widely used insulator on semiconductor devices. 40lb
Catalog Number: 71009-362
Supplier: KMG

Description: N-Methylpyrrolidone Cleanroom MB, Formula: C5H9NO, safer alternative to many hazardous solvents. NMP can be used remove cured photoresist, clean and dewax silicon wafers, and remove solder flux on printed circuit boards. CAS Number: 872-50-4, 9lb
Catalog Number: 71009-344
Supplier: KMG

Description: Hydrofluoric Acid 49% Cleenroom MB
Catalog Number: 71009-330
Supplier: KMG

Description: Sulfuric Acid 96% Gigabit*, Container: Poly Bottle, H2SO4, CAS number: 7664-93-9,used in Semiconductor Processing to remove residual organic contamination prior to metalization steps. 15lb
Catalog Number: 71009-382
Supplier: KMG

Description: Nitric Acid 69.5% Cleanroom LP, Cotainer: Poly bottle, Formula: HNO3, CAS Number: 7697-37-2, strong oxidizing agent, used to oxidize silicon to silicon dioxide and to dissolve metals to metal nitrates. 7lb
Catalog Number: 71009-340
Supplier: KMG

Description: Isopropanol Gigabit, Poly bottle, Molecular formula C3H8O, Cas: 67-63-0,used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions.1/Itm/Bx
Catalog Number: 71009-372
Supplier: KMG

Description: Ammonium Fluoride is used to dilute HF solutions for silicon dioxide film etching
Catalog Number: 89400-748
Supplier: KMG

Description: Sulfuric Acid 96% Cleanroom MB, Sulfuric acid, our high purity process chemical offering, is used in piranha solutions for organic removal. It is available in bottles, drums, totes and bulk. 771lb.
Catalog Number: 71009-532
Supplier: KMG

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