You Searched For: FUJIFILM ELECTRONIC MATERIALS U.S.A


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Description: Xylene Cleanroom LP -Amber Bottle, Formula: C8H10, It is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions. 13lb
Catalog Number: 71009-384
Supplier: KMG

Description: Hydrochloric Acid, 37% Polybottle, Formula: HCl, CAS Number: 7647-01-0,used in SC-2 solutions to remove surface metallic contamination from silicon wafers. 40lb
Catalog Number: 71009-358
Supplier: KMG

Description: Hydrochloric Acid 37% Cleanroom LP, Standard, Container: Poly bottle, Formula: HCl, CAS Number: 7647-01-0, key ingredient to remove surface metallic ions by forming soluble metal chlorides. 10lb
Catalog Number: 71009-324
Supplier: KMG

Description: Buffered Oxide Etchants are used to etch thin films of silicon dioxide and shape contact and via openings
Catalog Number: 89400-756
Supplier: KMG

Description: Acetone Cleanroom MB, Container: Poly Botttle, Formula: CH3COCH3, CAS: 67-64-1, can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover. (2-Propanone Dimethyl ketone DMK Propanone), 7lb
Catalog Number: 71009-318
Supplier: KMG

Description: Potassium Hydroxide 45% Cleanroom LP, Standard, Container: Poly bottle, Formula: KOH, CAS Number: 1310-58-3, used to etch silicon. The crystalline orientation of the silicon greatly affects the etch rate making potassium hydroxide an anisotropic etchant. 12lb
Catalog Number: 71009-346
Supplier: KMG

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