You Searched For: FUJIFILM ELECTRONIC MATERIALS U.S.A


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Description: Buffered Oxide Etchants are used to etch thin films of silicon dioxide and shape contact and via openings
Catalog Number: 89400-756
Supplier: KMG

Description: Acetone Cleanroom LP, Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover. 350lb.
Catalog Number: 71009-508
Supplier: KMG

Description: Hydrogen Peroxide, 30%, Cleanroom LP, Cas: 7722-84-1, Formula: H2O2, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination.
Catalog Number: 71009-366
Supplier: KMG

Description: Hydrogen Peroxide 30% Cleanroom MB, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-334
Supplier: KMG

Description: Acetone Cleanroom LP, can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover, Formula: CH3COCH3, CAS Number: 67-64-1, Polybottle, 4l
Catalog Number: KM402-200406
Supplier: KMG

Description: CR-16, is a Nitric Acid based chrome etchant used for photolithography masks, semiconductor and MEMS processes. It is designed to provide minimum undercutting, maximum critical dimension control and repeatability
Catalog Number: 10803-036
Supplier: KMG

Description: Hydrogen Peroxide 30% Gigabit*, Container: Poly Bottle, Formula: H2O2, CAS Number: 7722-84-1, used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. 9lb
Catalog Number: 71009-336
Supplier: KMG

Description: Hydrofluoric acid, 49%, Cleanroom Mb, Poly bottle, HF, CAS Number: 7664-39-3, critical chemistry in semiconductor processing. It is used to solubilize many oxides, particularly silicon dioxide, the most widely used insulator on semiconductor devices. 40lb
Catalog Number: 71009-362
Supplier: KMG

Description: N-Methylpyrrolidone Cleanroom MB, Formula: C5H9NO, safer alternative to many hazardous solvents. NMP can be used remove cured photoresist, clean and dewax silicon wafers, and remove solder flux on printed circuit boards. CAS Number: 872-50-4, 9lb
Catalog Number: 71009-344
Supplier: KMG

Description: Hydrofluoric Acid 49% Cleenroom MB
Catalog Number: 71009-330
Supplier: KMG

Description: Sulfuric Acid 96% Gigabit*, Container: Poly Bottle, H2SO4, CAS number: 7664-93-9,used in Semiconductor Processing to remove residual organic contamination prior to metalization steps. 15lb
Catalog Number: 71009-382
Supplier: KMG

Description: Ammonium Fluoride is used to dilute HF solutions for silicon dioxide film etching
Catalog Number: 89400-748
Supplier: KMG

Description: Sulfuric Acid 96% Cleanroom MB, Sulfuric acid, our high purity process chemical offering, is used in piranha solutions for organic removal. It is available in bottles, drums, totes and bulk. 771lb.
Catalog Number: 71009-532
Supplier: KMG

Description: Xylene Cleanroom LP -Amber Bottle, Formula: C8H10, It is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions. 13lb
Catalog Number: 71009-384
Supplier: KMG

Description: Ammonium Hydroxide 29% Cleanroom MB, Container: Poly Bottle, Formula: NH3, CAS Number: 1336-21-6, Storage: 0 Deg F - 80 Deg F, used in a SC-1 solution to remove organics and particles from the surface of a wafer. 8lb
Catalog Number: 71009-320
Supplier: KMG

Description: Isopropanol Cleanroom LP, IPA is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions, Formula: (CH3)2CHOH, CAS Number: 67-63-0, 4l
Catalog Number: KM431-200440
Supplier: KMG

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