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Description: Ammonium fluoride is used to dilute HF solutions for silicon dioxide film etching.
Catalog Number: 89400-748
Supplier: KMG

Description: Xylene can be used as a negative resist developer in semiconductor applications. Xylene is also mixed with HMDS, then spun on to a wafer to aid in adhesive of photoresist to the silicon wafer.
Catalog Number: 71009-384
Supplier: KMG

Description: Sulfuric acid is used in semiconductor processing to remove residual organic contamination prior to metalization steps.

Store at less than 109⁰ F
Catalog Number: 71009-532
Supplier: KMG

Description: Ammonium hydroxide is used in a SC-1 solution to remove organics and particles from the surface of a wafer. The ammonium hydroxide allows undercutting of the silicon dioxide freeing particles from the wafer by lift-off.

Storage: 0⁰ F - 80⁰F
Catalog Number: 71009-320
Supplier: KMG

Description: IPA is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions
Catalog Number: KM431-200440
Supplier: KMG

Description: Buffered oxide etchants are used to etch thin films of silicon dioxide and shape contact and via openings.
Catalog Number: 89400-756
Supplier: KMG

Description: N-Methylpyrrolidone (NMP) is a safer alternative to many hazardous solvents. NMP can be used remove cured photoresist, clean and dewax silicon wafers, and remove solder flux on printed circuit boards.
Catalog Number: 71009-344
Supplier: KMG

Description: Sulfuric Acid is used in semiconductor processing to remove residual organic contamination prior to metalization steps.
Store at less than 109⁰ F
Catalog Number: 71009-382
Supplier: KMG

Description: Hydrofluoric Acid 49% is used to soluabilize many oxides, particularly silicon dioxide, the most widely used insulator on semiconductor devices.
Catalog Number: 71009-362
Supplier: KMG

Description: IPA is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions.
Catalog Number: 71009-372
Supplier: KMG

Description: Nitric acid is a strong oxidizing agent. Nitric acid is used to oxidize silicon to silicon dioxide and to dissolve metals to metal nitrates. Nitric acid is used in combination with HF in mixed acid etchants to etch silicon.

Storage: <75⁰ F
Catalog Number: 71009-340
Supplier: KMG

Description: Hydrochloric Acid is a key ingredient to remove surface metallic ions by forming soluble metal chlorides.
Catalog Number: 71009-358
Supplier: KMG

Description: In semiconductor processing, the presence of metallic impurities on the wafer can lead to early dielectric breakdown. Hydrochloric acid is a key ingredient to remove surface metallic ions by forming soluble metal chlorides.

Storage: <80⁰ F
Catalog Number: 71009-324
Supplier: KMG

Description: Acetone Cleanroom LP, Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or edgebead remover. 350lb.
Catalog Number: 71009-508
Supplier: KMG

Description: Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.
Catalog Number: 71009-334
Supplier: KMG

Description: Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.
Catalog Number: 71009-366
Supplier: KMG