Copper ≥99.5%, Powder
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Avg. Ratings: 0.0 out of 5
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Danger
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93-2999-2000G
93-2999-100G
93-2999-500G
100209-088EA
338.28
USD
100209-088
100197-812
100200-750
Copper ≥99.5%, Powder
Copper
Formula:
Cu Boiling Pt: 2567 °C (1013 hPa) Melting Pt: 1083 °C Density: 8,92 Storage Temperature: Ambient |
MDL Number:
MFCD00010965 CAS Number: 7440-50-8 EINECS: 231-159-6 UN: 3089 ADR: 4.1,II |
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