Copper ≥99.5%, Powder

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93-2999-2000G 93-2999-100G 93-2999-500G
100209-088EA 338.28 USD
100209-088 100197-812 100200-750
Copper ≥99.5%, Powder
Copper
Formula: Cu
Boiling Pt: 2567 °C (1013 hPa)
Melting Pt: 1083 °C
Density: 8,92
Storage Temperature: Ambient
MDL Number: MFCD00010965
CAS Number: 7440-50-8
EINECS: 231-159-6
UN: 3089
ADR: 4.1,II

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