Copper ≥99.95% (trace metals basis), foil not certified pinhole-free, Thickness 0.015 mm

Supplier: BEANTOWN CHEMICAL - BTC
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222980-25X25MM 222980-50X50MM
BT222980-25X25EA 134 USD
BT222980-25X25 BT222980-50X50
Copper ≥99.95% (trace metals basis), foil not certified pinhole-free, Thickness 0.015 mm
Copper

CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94


  • Solid

Formula: Cu
MW: 63.55 g/mol
Boiling Pt: 2595
Melting Pt: 1083
Density: 8.94 g/mL
MDL Number: MFCD00010965
CAS Number: 7440-50-8
EINECS: 231-159-6
Merck Index: 13,02545

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Specification Test Results

Assay 99.95%


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