Copper ≥99.99% (trace metals basis), foil, Thickness 1.0 mm
Supplier: BEANTOWN CHEMICAL - BTC
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138315-50X1000
138315-50X250
138315-50X50MM
BT138315-50X10EA
282
USD
BT138315-50X10
BT138315-50X25
BT138315-50X50
Copper ≥99.99% (trace metals basis), foil, Thickness 1.0 mm
Copper
CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965
Solid; Molecular Formula: Cu; MW: 63.55
Melting Point: 1083.4°; Boiling Point: 2567°
Density (g/mL): 8.94
- Solid
Formula:
Cu Boiling Pt: 2567 °C Melting Pt: 1083.4 °C Density: 8.94 g/mL |
MDL Number:
MFCD00010965 CAS Number: 7440-50-8 EINECS: 231-159-6 |
Specification Test Results
Assay | 99.99% |
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